Next-Generation Intel® Xeon
Phi™ Processor with Integrated Intel® Omni Scale Fabric to Deliver Up to
3 Times the Performance of Previous Generation at Lower Power
NEWS HIGHLIGHTS
Announces
new microarchitecture and memory details of the next-generation Intel®
Xeon Phi™ processor (code-named Knights Landing), scheduled to power HPC
systems in the second half of 2015.
Intel® Omni Scale Fabric–
an end-to-end interconnect optimized for fast data transfers, reduced
latencies and higher efficiency – initially available as discreet
components in 2015, will also be integrated into next-generation Intel
Xeon Phi processor (Knights Landing) and future 14nm Intel® Xeon®
processors.
Intel continues to lead in HPC segment with 85
percent of all supercomputers on the latest TOP500* list powered by
Intel Xeon processors.
INTERNATIONAL
SUPERCOMPUTING CONFERENCE (ISC), Leipzig, Germany, June 23, 2014 –
Intel Corporation today announced new details for its next-generation
Intel® Xeon Phi™ processors, code-named Knights Landing, which promise
to extend the benefits of code modernization investments being made for
current generation products. These include a new high-speed fabric that
will be integrated on-package and high-bandwidth, on-package memory that
combined, promise to accelerate the rate of scientific discovery.
Currently memory and fabrics are available as discrete components in
servers limiting the performance and density of supercomputers.
The
new interconnect technology, called Intel® Omni Scale Fabric, is
designed to address the requirements of the next generations of
high-performance computing (HPC). Intel Omni Scale Fabric will be
integrated in the next generation of Intel Xeon Phi processors as well
as future general-purpose Intel® Xeon® processors. This integration
along with the fabric's HPC-optimized architecture is designed to
address the performance, scalability, reliability, power and density
requirements of future HPC deployments. It is designed to balance price
and performance for entry-level through extreme-scale deployments.
"Intel
is re-architecting the fundamental building block of HPC systems by
integrating the Intel Omni Scale Fabric into Knights Landing, marking a
significant inflection and milestone for the HPC industry," said Charles
Wuischpard, vice president and general manager of Workstations and HPC
at Intel. "Knights Landing will be the first true many-core processor to
address today's memory and I/O performance challenges. It will allow
programmers to leverage existing code and standard programming models to
achieve significant performance gains on a wide set of applications.
Its platform design, programming model and balanced performance makes it
the first viable step towards exascale."
Knights Landing – Unmatched Integration
Knights Landing will be available as a standalone processor mounted
directly on the motherboard socket in addition to the PCIe-based card
option. The socketed option removes programming complexities and
bandwidth bottlenecks of data transfer over PCIe, common in GPU and
accelerator solutions. Knights Landing will include up to16GB
high-bandwidth, on-package memory at launch – designed in partnership
with Micron* – to deliver five times better bandwidth compared to DDR4
memory1, five times better energy efficiency2 and three times more density2
than current GDDR-based memory. When combined with integrated Intel
Omni Scale Fabric, the new memory solution will allow Knights Landing to
be installed as an independent compute building block, saving space and
energy by reducing the number of components.
Powered
by more than 60 HPC-enhanced Silvermont architecture-based cores,
Knights Landing is expected to deliver more than 3 TFLOPS of
double-precision performance3 and three times the single-threaded performance4
compared with the current generation. As a standalone server processor,
Knights Landing will support DDR4 system memory comparable in capacity
and bandwidth to Intel Xeon processor-based platforms, enabling
applications that have a much larger memory footprint. Knights Landing
will be binary-compatible with Intel Xeon processors5, making it easy for software developers to reuse the wealth of existing code.
For
customers preferring discrete components and a fast upgrade path
without needing to upgrade other system components, both Knights Landing
and Intel Omni Scale Fabric controllers will be available as separate
PCIe-based add-on cards. There is application compatibility between
currently available Intel® True Scale Fabric and future Intel Omni Scale
Fabric, so customers can transition to new fabric technology without
change to their applications. For customers purchasing Intel True Scale
Fabric today, Intel will offer a program to upgrade to Intel Omni Scale
Fabric when it's available.
Knights
Landing processors are scheduled to power HPC systems in the second
half of 2015. For instance, in April the National Energy Research
Scientific Computing Center (NERSC) announced an HPC installation
planned for 2016, serving more than 5,000 users and over 700
extreme-scale science projects.
"We
are excited about our partnership with Cray and Intel to develop
NERSC's next supercomputer 'Cori,'" said Dr. Sudip Dosanjh, NERSC
Director, Lawrence Berkeley National Laboratory. "Cori will consist of
over 9,300 Intel Knights Landing processors and will serve as an on-ramp
to exascale for our users through an accessible programming model. Our
codes, which are often memory-bandwidth limited, will also greatly
benefit from Knights Landing's high speed on package memory. We look
forward to enabling new science that cannot be done on today's
supercomputers."
New Fabric, New Speeds with Intel Omni Scale Fabric Intel
Omni Scale fabric is built upon a combination of enhanced acquired IP
from Cray and QLogic, and Intel's own in-house innovations. It will
include a full product line offering consisting of adapters, edge
switches, director switch systems, and open-source fabric management and
software tools. Additionally, traditional electrical transceivers in
the director switches in today's fabrics will be replaced by Intel®
Silicon Photonics-based solutions, enabling increased port density,
simplified cabling and reduced costs6. Intel
Silicon Photonics-based cabling and transceiver solutions may also be
used with Intel Omni Scale-based processors, adapter cards and edge
switches.
Intel Supercomputing Momentum Continues The
current generation of Intel Xeon processors and Intel Xeon Phi
coprocessors powers the top-rated system in the world – the 35 PFLOPS
"Milky Way 2" in China. Intel Xeon Phi coprocessors are also available
in more than 200 OEM designs worldwide.
Intel-based
systems account for 85 percent of all supercomputers on the 43rd
edition of the TOP500 list announced today and 97 percent of all new
additions. Within 18 months after the introduction of Intel's first
many-core architecture products, Intel Xeon Phi coprocessor-based
systems already make up 18 percent of the aggregated performance of all
TOP500 supercomputers. The complete TOP500 list is available at
www.top500.org.
To
help optimize applications for many-core processing, Intel has also
established more than 30 Intel Parallel Computing Centers (IPCC) in
cooperation with universities and research facilities around the world.
Today's parallel optimization investment with the Intel Xeon Phi
coprocessor will carry forward to Knights Landing, as optimizations
using standards-based, common programming languages persist with a
recompile. Incremental tuning gains will be available to take advantage
of innovative new functionality.
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